发明名称 Semiconductor chip with external connecting terminal
摘要 A semiconductor device having a semiconductor chip and protective resin covering a sidewall of the semiconductor chip and having a surface formed so as to be flush with an inactive surface of the semiconductor chip. The semiconductor chip may be joined to a wiring board or another semiconductor chip. The semiconductor device may further include an external connecting terminal having an exposed portion exposed to the outside of the protective resin.
申请公布号 US7262490(B2) 申请公布日期 2007.08.28
申请号 US20050053892 申请日期 2005.02.10
申请人 ROHM CO., LTD. 发明人 SHIBATA KAZUTAKA
分类号 H01L23/495;H01L25/18;H01L21/301;H01L21/304;H01L21/56;H01L21/60;H01L23/12;H01L23/28;H01L23/31;H01L25/065;H01L25/07 主分类号 H01L23/495
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