摘要 |
PROBLEM TO BE SOLVED: To provide a method which allows easy bonding of an adherend without using an adhesive, even if the adherend is a plastic or the like having no tackiness in advance. SOLUTION: In a method for bonding a plastic or the like, which bonds a first adherend comprising a plastic and a second adherend, the method is characterized in that it has a process for irradiating at least the plastic bonding surface of the first adherend with an energy beam of 4 eV or higher energy and a process for bonding the first and second adkherends under ambient temperature without using the adhesive, that the first and second adherends have no tackiness or adhesiveness before the energy beam irradiation and that pressure-sensitive adhesiveness or adhesiveness is imparted to the first adherend by the energy beam irradiation. COPYRIGHT: (C)2007,JPO&INPIT
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