| 摘要 |
A semiconductor package and its manufacturing method are provided to accurately seize a reference point by using distinguishable inclined angles between first and second inclined portions, thereby easily judging good products and bad products. LED chips(42) are mounted on a lower substrate(30), and an upper substrate(36) is placed on the lower substrate. The upper substrate has two upper and lower ceramic sheet layers(32,34). A cavity(first inclined portion) is formed on a center portion of the lower ceramic sheet layer at a right angle, and is filled with a silicon or phosphor and an epoxy(46). A cavity(second inclined portion) is formed on a center portion of the upper ceramic sheet layer at an obtuse angle, and is filled with a silicon or an epoxy(48). |
