| 摘要 |
Provided is a technology for improving heat dissipating performance in a mounting structure of a driver IC chip and a driver module in a flat display device. The plasma display device is provided with a panel (PDP) (74); a structure of a chassis section (73) arranged close to the back plane of the panel; a GB-ADM (address driver module) (71) having a flexible substrate (51) whereupon a driver IC chip (56) for driving the electrode of the panel (74) is mounted by GB (gang bonding) method; and a holding plate (75) for holding and fixing the driver IC chip (56) between the chassis section (73) and the holding plate. Furthermore, the GB-ADM (71) is sandwiched between the chassis section (73) and the holding plate (75), and first and second elastic heat conducting members (21-1, 21-2) having different characteristics are provided.
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