| 发明名称 |
Methods of forming conductive interconnects, and methods of depositing nickel |
| 摘要 |
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.
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| 申请公布号 |
US7358170(B2) |
申请公布日期 |
2008.04.15 |
| 申请号 |
US20050149578 |
申请日期 |
2005.06.09 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
TIWARI CHANDRA |
| 分类号 |
H01L21/20;B05D1/18;C23C18/16;C23C18/32;H01L21/288;H01L21/302;H01L21/31;H01L21/311;H01L21/44;H01L21/4763;H01L21/768;H01L23/48 |
主分类号 |
H01L21/20 |
| 代理机构 |
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