发明名称 Resin composition based on crystalline polypropylene
摘要 Present invention provides a resin composition bases on crystalline polypropylene which does not suffer from occurrence of flow mark and rashes caused from polymer gel upon molding and, thus, can produce molded articles exhibiting superior appearance and having excellent mechanical strength, such as flexural modulus and so on, together with better flowability upon the molding and which can be obtained at a lower cost by choosing starting materials of high productivity. The resin composition based on crystalline polypropylene according to the present invention comprises (a) 3-65% by weight of a component soluble in paraxylene of 23° C. (b) 35-97% by weight of a component soluble in paraxylene of 135° C. and insoluble in paraxylene of 23° C. and (c) 0-30% by weight of a component insoluble in paraxylene of 135° C., wherein the component (a) soluble in paraxylene of 23° C. is composed substantially of an elastomeric constituent (a1) having a content of styrene or its derivative in the range of 0-35% by weight and an intrinsic viscosity [eta] determined in decalin at 135° C. in the range of 0.1-5 dl/g, the component (b) soluble in paraxylene of 135° C. and insoluble in paraxylene of 23° C. is composed substantially of a crystalline polypropylene constituent (b1) having an isotactic pentad proportion (mmmm) of 97% or higher, a molecular weight distribution expressed by weight-average molecular weight/number-average molecular weight (Mw/Mn), determined by gel permeation chromatography (GPC), of 6 or higher and a molecular weight distribution expressed by z-average molecular weight/weight-average molecular weight (Mz/Mw) of 6 or higher and the component (c) insoluble in paraxylene of 135° C. is composed substantially of a filler (c1).
申请公布号 US2002058741(A1) 申请公布日期 2002.05.16
申请号 US20010881677 申请日期 2001.06.18
申请人 SAKAI IKUNORI;TAKAOKA TOHRU;MORIYA SATORU;HASHIMOTO MIKIO;NAKAGAWA HIDEKI;YOSHIKAWA HIROSHI 发明人 SAKAI IKUNORI;TAKAOKA TOHRU;MORIYA SATORU;HASHIMOTO MIKIO;NAKAGAWA HIDEKI;YOSHIKAWA HIROSHI
分类号 C08F10/06;C08F110/06;C08F210/02;C08F210/16;C08F210/18;C08L23/10;C08L53/00;C08L53/02;(IPC1-7):C08K3/34 主分类号 C08F10/06
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