| 摘要 |
An RF module adapted for direct surface mounting to the top surface of the front end of the motherboard of a wireless base station such as, for example, a femtocell. The module comprises a printed circuit board having a plurality of direct surface mounted electrical components defining respective signal transmit and receive sections for RF signals. The signal transmit section is defined by at least a power amplifier, a coupler, and a lowpass filter. The signal receive section is defined by at least a receive bandpass filter and a low-noise amplifier. A lid covers selected ones of the electrical components except for at least the power amplifier. An RF switch is located between and interconnects the respective transmit and receive sections to an antenna pin.
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