发明名称 Flooring system
摘要 Described herein are flooring systems comprising: a first floor panel and a second floor panel, each of the first and second floor panels comprising: a top surface, a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces; and a coupling surface formed on one peripheral edge; the coupling surfaces of the first and second floor panels being disposed proximate to each other forming a joint; and a thermally activated solid adhesive interspersed between the coupling surfaces of the first and second floor panel. Methods of installing these systems are also described.
申请公布号 US9394697(B2) 申请公布日期 2016.07.19
申请号 US201414566274 申请日期 2014.12.10
申请人 AFI Licensing LLC 发明人 Ramachandra Sunil
分类号 E04B2/00;E04F15/02;E04F15/10;B32B37/12 主分类号 E04B2/00
代理机构 代理人
主权项 1. A flooring system comprising: a first floor panel and a second floor panel, each of the first and second floor panels comprising: a first layer having a top surface opposite a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces of the first layer;a second layer having a top surface opposite a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces of the second layer; anda third layer comprising a thermally activated solid adhesive that is comprised of a thermoplastic material that does not melt and bond the coupling surfaces of the first and second floor panel together until the creation of heat in the joint; wherein the bottom surface of the first layer is coupled to the top surface of the second layer in an offset relationship that defines a first offset marginal portion and a second offset marginal portion; and wherein the third layer is positioned between the first and second layers and the third layer covers at least a part of the first or second offset marginal portions and spans a length of a coupling portion of each of the bottom surface of the first layer and the top surface of the second layer.
地址 Lancaster PA US