| 摘要 |
PROBLEM TO BE SOLVED: To improve intensity and flexure processing in titanium copper, by controlling variation of Ti density by an aspect different from that in a conventional art.SOLUTION: The invention relates to the titanium copper for electronic part comprising: 2.0-4.0 mass% of Ti; as a third element, one or more kinds selected from a group of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P by total amount of 0-0.5 mass%; and as a balance, copper and inevitable impurities. In the titanium copper for electronic part, a Ti density variation curve and a Ti density average line which are obtained when Ti in a parent phase about crystal grains of a <100> orientation in a cross section being parallel to a rolling direction is subjected to line analysis with EDX, satisfy a relation in which an average length of each mountain part on the Ti density variation curve which occupies the Ti density average line becomes 5-20 nm, and the number of second phase grains whose size is equal to or larger than 3 μm on a tissue observation on the cross section being parallel to the rolling direction, for an observation field of 10000 μm, is 35 or less.SELECTED DRAWING: Figure 1 |
