| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder material that has a low melting point, suppresses separation and breakage of an interface layer in a high-temperature environment, and gives excellent mechanical properties to a bond, and to provide a mounting structure using the same.SOLUTION: The solder material contains Sn, Bi and In as essential components. The content of the Bi is in a range of 50-70 mass%, the content of the In is in a range of 10-25 mass%, and the balance comprises the Sn and inevitable component. |
