| 发明名称 | Flexible microsystem structure | ||
| 摘要 | A flexible microsystem structure is provided. The flexible microsystem structure includes a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements. | ||
| 申请公布号 | US9412692(B2) | 申请公布日期 | 2016.08.09 |
| 申请号 | US201514596079 | 申请日期 | 2015.01.13 |
| 申请人 | WINBOND ELECTRONICS CORP. | 发明人 | Cheng Yu-Ting;Fu Yu-Min |
| 分类号 | H01L29/15;H01L23/498;H01L23/00 | 主分类号 | H01L29/15 |
| 代理机构 | Muncy, Geissler, Olds & Lowe, P.C. | 代理人 | Muncy, Geissler, Olds & Lowe, P.C. |
| 主权项 | 1. A flexible microsystem structure, comprising: a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements, wherein a width of the trench is smaller than a width of the bonding element. | ||
| 地址 | Taichung TW | ||