METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND UNDERFILL FILM

摘要

Provided are a method for manufacturing a semiconductor device and an underfill film by which it is possible to attain voidless mounting and an excellent solder joint even when a plurality of semiconductor chips are simultaneously pressure bonded. The method for manufacturing a semiconductor device includes the following: a mounting step in which a plurality of semiconductor chips on which soldered electrodes are formed are mounted on an electronic component that has formed thereon counter electrodes that face the soldered electrodes with an underfill film therebetween; and a pressure bonding step in which the plurality of semiconductor chips are simultaneously pressure bonded to the electronic component with the underfill film therebetween. The underfill film includes an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide. The underfill film has a minimum melt viscosity of 1000 Pa∙s-2000 Pa∙s, and the slope of the melt viscosity from a temperature 10˚C higher than a minimum melt viscosity temperature to a temperature further increased by 10˚C is 900 Pa∙s/˚C-3100 Pa∙s/˚C.