发明名称 MULTI-LAYER THERMAL CONDUCTIVE PANEL ON A FLOOR WITH FLOOR HEATING
摘要 A panel is assembled on a layer with a built-in surface heat source; it contains a carrier layer (1) made of non-absorbent, wood- based, standard hardboard and its upper surface consists of a surface layer (3) made of wooden, wooden-based lamella, terracotta, ceramic or stone plate. Between the carrier layer (1) and the surface layer (3), it has a heating plate (4) pasted to which fiat fronts constituting heat-pipes (5) are adjoined from the side of the carrier layer (1), which are put in and pasted into transverse crevices, cut in the carrier layer (1) parallel to the longer sides and with a length smaller than them, and with ends placed at equal distances from the perpendicular sides of the panel. The heat plate (4) and the heat-pipes (5) are made of high heat conductivity coefficient material, especially aluminium or magnesium alloy, while the material from which the carrier layer (1) is made is characterized by high heat absorption capability, approx. 2000 J/kgK and low heat conductivity coefficient λ < 0.4.
申请公布号 WO2016130033(A1) 申请公布日期 2016.08.18
申请号 WO2016PL00015 申请日期 2016.02.11
申请人 STACHOWICZ, Jerzy 发明人 STACHOWICZ, Jerzy;OĆWIEJA, Jarosław
分类号 E04F15/10;E04F15/02;F24D3/14 主分类号 E04F15/10
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