| 摘要 |
PROBLEM TO BE SOLVED: To improve signal transmission characteristics of a semiconductor device.SOLUTION: A semiconductor device comprises a plurality of interconnections 16 which are arranged on a wiring board on which a semiconductor chip is mounted and have an interconnection 16SG1 and an interconnection 16SG2 which compose a differential pair for transmitting a differential signal. The interconnection 16SG1 and the interconnection 16SG2 have: portions PT1, respectively, which run side by side with a clearance SP1; portions PT2 which are provided in the same wiring layer of the portions PT1, respectively, and which run side by side with a clearance SP2; and portions PT3 which are provided between the portions PT1 and the portions PT2 and detoured in a direction to increase the clearance to be larger than each of the clearance SP1 and the clearance SP2.SELECTED DRAWING: Figure 8 |
