发明名称 複合材料構造物及びその製造方法
摘要 There is provided a composite structure including: at least two substrates which are made of thermoplastic resin and which are bonded by thermocompression; and at least one member which is made of a material whose heat distortion temperature is higher than a heat distortion temperature of the thermoplastic resin and which is inserted into a space formed in at least one of the substrates. The member inserted in the space is fixed and held by wall surfaces which form the space of the substrates and which are thermally deformed by thermocompression.
申请公布号 JP5974429(B2) 申请公布日期 2016.08.23
申请号 JP20110158723 申请日期 2011.07.20
申请人 ソニー株式会社 发明人 行本 智美;山崎 剛;秋山 昭次;秋山 雄治
分类号 B29C65/02;B01J19/00;B29C65/56;G01N37/00 主分类号 B29C65/02
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