| 摘要 |
A method and apparatus for handling semiconductor crystals. The method includes securing a large semiconductor wafer to a deformable plastic carrier, scribing and breaking the wafer into a plurality of small crystals, and stretching the carrier to separate the individual crystals while maintaining their orientation. The apparatus includes a hollow cylinder, a piston and a plug seated on the piston; the carrier having the wafer thereon is clamped to the cylinder and the piston and plug are moved vertically to stretch the carrier. Then the carrier may be secured to the plug for further utilization.
|
