发明名称 |
Method for making mask aligned narrow isolation grooves for a semiconductor device |
摘要 |
A method for making mask aligned narrow isolation grooves for a semiconductor device in which an insulating layer is filled in a groove of the semiconductor substrate to form an island region surrounded by the insulating layer, which comprises the steps of forming a mask pattern on a major surface of the semiconductor substrate in such a manner that its side wall is at a taper angle of 90 DEG or less with respect to a major surface of the semiconductor substrate; ion-implanting an impurity of a conductivity type opposite to that of the semiconductor substrate into the semiconductor substrate using the mask pattern; causing a groove for the insulating material to be formed in the semiconductor substrate around the side wall of the mask pattern; filling the groove with insulating material to form a narrow insulating layer; and diffusing the implanted impurity to form an isolation region surrounded by the insulating material.
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申请公布号 |
US4463493(A) |
申请公布日期 |
1984.08.07 |
申请号 |
US19820423300 |
申请日期 |
1982.09.24 |
申请人 |
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA |
发明人 |
MOMOSE, HIROSHI |
分类号 |
H01L27/08;H01L21/265;H01L21/302;H01L21/3065;H01L21/31;H01L21/76;H01L21/762;H01L21/8238;(IPC1-7):H01L21/22 |
主分类号 |
H01L27/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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