发明名称 Method for making mask aligned narrow isolation grooves for a semiconductor device
摘要 A method for making mask aligned narrow isolation grooves for a semiconductor device in which an insulating layer is filled in a groove of the semiconductor substrate to form an island region surrounded by the insulating layer, which comprises the steps of forming a mask pattern on a major surface of the semiconductor substrate in such a manner that its side wall is at a taper angle of 90 DEG or less with respect to a major surface of the semiconductor substrate; ion-implanting an impurity of a conductivity type opposite to that of the semiconductor substrate into the semiconductor substrate using the mask pattern; causing a groove for the insulating material to be formed in the semiconductor substrate around the side wall of the mask pattern; filling the groove with insulating material to form a narrow insulating layer; and diffusing the implanted impurity to form an isolation region surrounded by the insulating material.
申请公布号 US4463493(A) 申请公布日期 1984.08.07
申请号 US19820423300 申请日期 1982.09.24
申请人 TOKYO SHIBAURA DENKI KABUSHIKI KAISHA 发明人 MOMOSE, HIROSHI
分类号 H01L27/08;H01L21/265;H01L21/302;H01L21/3065;H01L21/31;H01L21/76;H01L21/762;H01L21/8238;(IPC1-7):H01L21/22 主分类号 H01L27/08
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