| 摘要 |
PROBLEM TO BE SOLVED: To simplify work for binding wires and prevent a loss of binding bands. SOLUTION: A wire binding apparatus 2 comprises a resinous binding band 4 and a resinous mounting tool 5 for mounting the binding band inside a case 1 of a distributing board. A clip 7 for clipping the binding band 4 is integrally formed on a base 6 of the mounting tool 5. The clip 7 is provided with a hooking piece 8 for hooking the binding band 4 and a pair of left and right holding pieces 9 for pressing the binding band 4 to the hooking piece 8 and holding the curved binding band 4. Slits 11, in which the binding band is inserted or detached in the direction of width, are formed between the hooking piece 8 and the holding pieces 9. |
