发明名称 MANUFACTURE OF SMOOTH WIRING CIRCUIT BOARD
摘要 PURPOSE:To remove a step between a conductor pattern and the resin surface of an insulating board whereon this is formed so as to smooth the sliding of slider by forming the conductor pattern on the insulating board under noncrystallized conditions and applying smoothing treatment to this insulating substrate at a crystallizing temperature. CONSTITUTION:An insulating board 22, wherein conductor patterns 25 and 26 are projected in projecting shape and which is under noncrystallized conditions, is put between specular face stainless plates, and this is inserted between the hot plates of a hot press so as to perform heating and pressing treatments by the hot press, whereby the insulating substrate 22 is crystallized in the conditions where the conductor patterns 25 and 26 are buried in the insulating substrate 22 leaving the surfaces in the middle of shifting from the soft and noncrystallized conditions to the firm and completely crystallized conditions. Hereby, the manufacturing of a wiring circuit board 21 excellent in smoothness becomes possible. AS a result, for the bottom face of a slider 23, since the conductor pattern 26(25) and the resin surface 22a have become the smoothed conditions without a step at the position on the same level, the slider 23 slides smoothly and can shift to the position of a required conductor pattern.
申请公布号 JPH0335588(A) 申请公布日期 1991.02.15
申请号 JP19890170948 申请日期 1989.06.30
申请人 AICHI ELECTRIC CO LTD 发明人 WATANABE YUTAKA;KIMURA NOBUMASA
分类号 H05K1/03;H01H21/12;H05K3/22;H05K3/24 主分类号 H05K1/03
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