| 摘要 |
PURPOSE:A new polyhydric phenol providing epoxy resins which are useful for sealing electronic parts, have excellent low hygroscopicity and have a good balance between heat resistance and curability. CONSTITUTION:A polyhydric phenol of formula I [R1-9 are H, 1-9C alkyl, cycloalkyl, halogen; X is H, 1-9C alkyl. aryl; n is 0, 1-10 (preferably 0, 1-2)]. The compound is produced by condensing a bisphenol compound of formula II with an aldehyde compound in the presence of an acidic catalyst. |
