发明名称 BLOW FORMING METHOD OF RESIN FORM
摘要 PURPOSE:To secure a predetermined thickness ratio and improve molding property as well as mold release characteristics by a method wherein an expander member, equipped with a temperature control unit, is moved to orient the non- predetermined site of a parison and, thereafter, the predetermined site of the parison is heated before closing a mold and effecting blow molding. CONSTITUTION:In a blow molding device 1, a predetermined thermosetting resin is molded preliminarily so as to have the shape of a tube by a parison extruder 2 and softened parison 7 is extruded from an accumulator head 11. Then, the parison 7 is molded by a molding mold 3 so as to have a predetermined configuration. Further, compressed air is blown into the parison 7 by a blowing device 4. Thereafter, the parison 7 is provided with different thickness in the peripheral direction of the parison 7 by a pair of expander panels 8 driven by a driving device 5. In this case, a non-predetermined site is oriented while cooling the predetermined sites of the parison 7 by the temperature control units 31 of respective panels 8 and, thereafter, the predetermined sites are heated. According to this method, a predetermined thickness ratio is secured in the resin form while the forming property of said thick parts and the mold release characteristics of respective panels 8 are improved.
申请公布号 JPH05269825(A) 申请公布日期 1993.10.19
申请号 JP19920073792 申请日期 1992.03.30
申请人 发明人
分类号 B29C49/04;B29C49/10;B29C49/42;B29C49/64;B29L22/00;(IPC1-7):B29C49/10 主分类号 B29C49/04
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