发明名称 |
METAL-CLAD POLYIMIDE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal-clad polyimide film having sufficient mechanical strength and heat resistance. SOLUTION: The metal-clad polyimide film is manufactured by forming a metal layer with a thickness of 1-10μm on a conductive substrate, providing an insulating resin layer comprising an electrodeposition film formed on an organic soluble polyimide on the surface of the metal layer, and subsequently peeling the conductive substrate. The metal-clad polyimide film thus manufactured is also disclosed. |
申请公布号 |
JP2002172733(A) |
申请公布日期 |
2002.06.18 |
申请号 |
JP20000372869 |
申请日期 |
2000.12.07 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
KAWAI KENZABURO |
分类号 |
B32B15/088;B32B15/08;C08G81/00;C25D13/06;H05K3/00;H05K3/46;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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