| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be developed by a diluted alkali aqueous solution, which is capable of giving a hardened material having large photohardening depth at exposing, high resolution and superior heat resistance, chemical resistance and electrical characteristics and which is suitable for the formation of a solder resist and an interlayer insulating layer of a printed circuit board. SOLUTION: For the basic morphology of a photosensitive resin composition contains (A) a photosensitive prepolymer having one or more unsaturated double bonds and one or more carboxyl groups in a single molecule and (B) a bis acylphosphine oxide photopolymerizing initiator and preferably, (C) other photopolymerizing initiators are used, together with the bis acylphosphine oxide photopolymerizing initiator. The photosensitive resin composition which is suitable as a solder resist film or resin insulating layer of a printed circuit board contains (A) the photosensitive prepolymer to, (B) the bis acylphosphine oxide photopolymerizing initiator, (C) the other photopolymerizing initiator, (D) a reactive diluent and (E) a thermosetting compound. |
