Integrated circuit package with a heat spreader coupled to a pair of electrical devices

摘要

A multi-chip module which contains a heat spreader that maintains a relatively uniform temperature profile between the devices of the module. The module includes a first electronic device and a second electronic device that are both mounted to a package. The devices are electrically connected by routing within the package. A heat spreader that is thermally coupled to both devices. The heat spreader transfers the heat generated by the electronic devices so that the devices operate at approximately the same temperature. A heat slug may be attached to the heat spreader to reduce the thermal impedance of the module.