| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonder and a wire-bonding method, which can inspect the interval between chips without needing a separated exclusive eternal appearance tester. SOLUTION: In a wire bonding method for connecting the electrode 3a of a chip 3 mounted on a board 2 with the electrode 2a of the board 2 by bonding wire 4, a wire bonder recognizes the chip 3 and stores the recognition results and computes the interval d between the adjacent chips, based on this recognition results, and compares the obtained interval between chips with the preset allowable value of the interval between chips thereby performing a decision on whether it has passed test or not. Hereby, this can inspect the interval between the chips, in a wire-bonding process, without using a separate exclusive external appearance tester. |
