| 摘要 |
PROBLEM TO BE SOLVED: To enable the optimal position of bonds to be determined by a method wherein an indication that indicates a change in an arrangement position to a position determining means is provided, when an evaluation result of an evaluating means indicates that it does not meet constraint conditions. SOLUTION: It is evaluated by a constraint sufficiency evaluation part 28, whether the tentative position of bonds determined by a single B tentative position determination part 25 as a first positioning means, and the tentative position of pads determined by a P tentative position determination part 27 as a second positioning means, meet wiring processing constraint conditions or not. The constraint sufficiency evaluation part 28 indicates to the single B tentative position determination part 25 or the P tentative position determination part 27 that a tentative position must be changed when wiring processing constraint conditions are not met. By this setup, an optimal position can be determined even when wiring processing constraint conditions are not met if the bonds are not changed in arrangement position. |
