| 摘要 |
A semiconductor package structure with exposed die pad is proposed. The proposed package structure comprises a lead frame having a die pad and a plurality of leads, with the bottom surface being formed with a cutaway portion at the peripheral edge thereof; a semiconductor chip mounted on the front surface of the die pad and electrically coupled to the leads; and an encapsulation body for encapsulating the semiconductor chip and part of the leads, with the bottom surface of the die pad being exposed to the outside of the encapsulation body. The cutaway portion can serve as a constricted passage when the die pad is clamped between a pair of encapsulating molds, so that the molding resin injected into the encapsulating molds would be slowed down in flow speed within the cutaway portion since the molding resin within the cutaway portion would be able to more quickly absorb the heat of the molds, thereby increasing its viscosity so that the molding resin would be less likely to flash onto the bottom surface of the die pad. As a result, the finished semiconductor package structure would be more cost-effective to implement and more assured in quality and reliability.
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