SUBSTRATE TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating device that can reduce the occurrence of an erroneous treatment of substrates caused by delayed measurement to the minimum. SOLUTION: This substrate treating device also incorporates a measurement unit 1 and transports a wafer W to the unit 1 by means of transporters 21 and 22 incorporated in the device 50. In addition, the device 50 measures a pattern formed on the wafer W through pattern matching in a technique based on scatterometry.