| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated semiconductor device capable of ensuring electric connection, and of improving reliability. SOLUTION: The laminated semiconductor device is provided with: two or more first electrode pads 18 of a first semiconductor device 51a; two or more second electrode pads 18 of a second semiconductor device 51b; a conductive member 84 embedded in a through hole 83 in an insulator 81; and two or more wiring spacers 71 for connecting electrically the first electrode pads 18 and the second electrode pads 18 by conductive member 84. The two or more wiring spacers 71 are juxtaposed between the first electrode pads 18 and the second electrode pads 18, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
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