发明名称 MASKING METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a masking method capable of correctly masking an object to a predetermined position even when a masking shape is complicated, and to simply mask a substrate without bringing a large facility into a process. SOLUTION: The release coated paper 3 of a film sheet 1 is obtained by sticking a release coated paper 3 on a lower surface using a first adhesive material 2, sticking a reinforcing film 5 on an upper surface with a second adhesive material 4, and die-cutting them into a desired pattern shape. The release coated paper is removed, and the adhesive surface of the first adhesive material 2 of the film sheet 1 is stuck on an object 8 while aligning a reference position of the film sheet 1 to a reference position of an object, and then the reinforcing film 5 of the film sheet 1 is removed. Simultaneously, the film sheet 1 and the object are subjected to contact bonding to mask a predetermined region of the object 8 corresponding to the desired pattern shape of the film sheet 1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005236029(A) 申请公布日期 2005.09.02
申请号 JP20040043251 申请日期 2004.02.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 OBAYASHI YASUTAKA;MITSUKI MITSUHISA
分类号 B05D1/32;H05K3/34;(IPC1-7):H05K3/34 主分类号 B05D1/32
代理机构 代理人
主权项
地址