| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce flocculation and deterioration of slurry, to form a work defect of a wafer surface in a CMP device, and to reduce deterioration of a polishing state. <P>SOLUTION: A slurry device 100 supplies polishing solution 204 to a chemical mechanical polishing device for semiconductor wafer. The slurry device is provided with a slurry tank storing slurry, slurry tank circulation piping which is connected to the slurry tank and in which slurry in the tank can be circulated, a slurry tank circulation transmitter transmitting slurry from the slurry tank to slurry tank circulation piping, a slurry tank detector which is installed in the slurry tank and detects a storage amount of slurry in the tank, and a slurry tank circulation control unit which drives the slurry tank circulation transmitter within setting time that is previously set in accordance with the storage amount of slurry detected by the slurry tank detector, and circulates slurry. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
