| 摘要 |
PROBLEM TO BE SOLVED: To provide compact electronic equipment having a heat radiation mechanism with large heat release. SOLUTION: The electronic equipment 1 comprises an electronic equipment body 8 having a casing 101 where internal heat is transferred; a liquid refrigerant tank 2 that is mounted to the electronic equipment body 8 and stores a liquid refrigerant 38 inside; and a capillary force member 3 provided on the outer surface of the casing 101 in the electronic equipment body 8. At least one portion of the capillary force member 3 can be brought into contact with the liquid refrigerant 38 stored in the liquid refrigerant tank 2. COPYRIGHT: (C)2007,JPO&INPIT
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