发明名称 |
Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby |
摘要 |
A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number. |
申请公布号 |
US2008030969(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20070808298 |
申请日期 |
2007.06.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE JUNG W.;CHUNG YUL K.;LEE IN HYUNG |
分类号 |
H05K7/02;H01L21/62 |
主分类号 |
H05K7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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