Heat dissipation device

摘要

A heat dissipation device includes a primary heat sink ( 10 ) contacting a central processing unit and a secondary heat sink ( 20 ) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base ( 12 ) and a heat-dissipation portion ( 14 ) disposed on a middle of the base. The secondary heat sink includes a substrate ( 22 ) and a plurality of fin assemblies ( 24 ) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.