| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film excellent in adhesiveness and reliability of connection. SOLUTION: The adhesive film consisting of resin compositions, containing (A) (meta) acrylic acid ester copolymer, (B) epoxy resin, (C) phenol resin and (D) inorganic filler, is constituted so that the amount of blendings of (A) constituent in the resin compositions in a weight reference is smaller than the total of the amount of blendings of (B) constituent and (C) constituent while a shearing stress in a plane at the end of interface with a silicon wafer is not more than 2.5 MPa. COPYRIGHT: (C)2008,JPO&INPIT |
