发明名称 |
SEMICONDUCTOR PACKAGE SYSTEM WITH PATTERNED MASK OVER THERMAL RELIEF |
摘要 |
A semiconductor package system including: providing a substrate having a thermal relief thereon; depositing a mask on the substrate and the thermal relief, the mask deposited on the thermal relief and having a regular pattern to partially cover the thermal relief; and die attaching a semiconductor die over the thermal relief.
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申请公布号 |
US2009008768(A1) |
申请公布日期 |
2009.01.08 |
申请号 |
US20070773951 |
申请日期 |
2007.07.05 |
申请人 |
ALABIN LEOCADIO M;GATBONTON LIBRADO;ONG CHIU HSIEH;TEH BENG YEE;DIMAANO JR ANTONIO B |
发明人 |
ALABIN LEOCADIO M.;GATBONTON LIBRADO;ONG CHIU HSIEH;TEH BENG YEE;DIMAANO, JR. ANTONIO B. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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