| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame or substrate for an LED and a manufacturing method thereof and a semiconductor and a manufacturing method thereof to allow light from an LED element to be effectively reflected as well as gas corrosion to be suppressed and good characteristics of reflecting the light from the LED element to be maintained. <P>SOLUTION: An LED lead frame or substrate 10 comprises a body 11 having a mounting surface 11a for placing an LED element 21. The mounting surface 11a of the body 11 is provided with a plating layer 12 for reflecting light, functioning as a reflection layer to reflect light from the LED element 21. The plating layer 12 for reflecting light is composed of an alloy of tin and silver. With the plating layer 12 for reflecting light, the light from the LED element 21 is reflected effectively as well as gas corrosion is suppressed, and characteristics of reflecting the light from the LED element 21 can be maintained. <P>COPYRIGHT: (C)2012,JPO&INPIT |
