| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical device 1 capable of reducing the height and size of the device, and mounting a flip chip on a flat surface of a circuit board with a surface opposite to an optical surface KP as a mounting surface.SOLUTION: An optical device 1 of the present invention comprises: a first substrate 2; a second substrate 3; and optical chips 4 that are accommodated in the substrates. The first substrate 2 has a concave part 5, and through electrodes 6 that each penetrate from an outer peripheral end face TP of the concave part 5 to a rear face BP on the opposite side. The second substrate 3 has an intermediate electrode 7 on the surface; and the intermediate electrode 7 and the through electrodes 6 are electrically connected with each other, and joined to the outer peripheral end face TP. The optical chip 4 is mounted on the surface of the second substrate 3 so as to be electrically connected with the intermediate electrode 7, and accommodated in the concave part 5. |
