发明名称 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム
摘要 A method of manufacturing a semiconductor device, includes: forming a film containing a predetermined element on a substrate by performing a cycle a predetermined number of times, the cycle including: supplying a first precursor containing the predetermined element and a halogen group to the substrate; supplying a second precursor containing the predetermined element and an amino group to the substrate; and supplying a reducing agent not containing halogen, nitrogen and carbon to the substrate.
申请公布号 JP5959907(B2) 申请公布日期 2016.08.02
申请号 JP20120091336 申请日期 2012.04.12
申请人 株式会社日立国際電気 发明人 佐野 敦;▲ひろせ▼ 義朗
分类号 H01L21/205;C23C16/24 主分类号 H01L21/205
代理机构 代理人
主权项
地址