HEAT TREATMENT SYSTEM, HEAT TREATMENT METHOD, AND PROGRAM

摘要

The present invention relates to a heat treatment system, a heat treatment method, and a program to control an in-plane shape of a treatment object. The heat treatment system (1) comprises: a heater unit (10) which heats the inside of a reaction pipe (2) accommodating a plurality of semiconductor wafers (W); a heat treatment condition storage means which stores a heat treatment condition according to heat treatment; a heat treatment change model storage means which stores a heat treatment change model representing the relative change in temperature inside the reaction pipe (2) and change in heat treatment result; a heat treatment performing means which performs a heat treatment result in the heat treatment condition; a heat treatment result reception means which receives the performed heat treatment result; and an optimal temperature calculation means which calculates a targeted heat treatment result about an in-plane shape of the semiconductor wafer (W) on the basis of the shape of the aimed heat treatment result, and calculates an aimed heat treatment result about the calculated in-plane shape and optimal temperature which is the aimed heat treatment result on the basis of the heat treatment change model.