| 摘要 |
PROBLEM TO BE SOLVED: To properly manufacture a package by transfer molding, the package being suitable for peeling reduction by minimizing a difference in coefficient of linear expansion between a semiconductor chip and a mold resin and a lead frame and the mold resin.SOLUTION: As a resin tablet 200, used is one in which a mold resin 201 on a head side at injecting has a larger coefficient of linear expansion than that of a mold resin 202 on a rear side at injecting, and a mold resin 10 is infused from immediately above of a semiconductor chip 20 through a gate 104, and is expanded to a lead frame 30 side of a semiconductor chip peripheral part. Thus, a small coefficient of linear expansion part 11 near the semiconductor chip of the mold resin 10 is sealed by the mold resin 10 so that the coefficient of linear expansion is smaller than a large coefficient of linear expansion part 12 near the lead frame.SELECTED DRAWING: Figure 3 |
