| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thickness size of a semiconductor device, having twice the capacity by superposing and fixing two center pad semiconductor chips on the rear surfaces on one side surface of a circuit board constituted, so that the difference in the lengths of drawing-around wirings between an external land and a finger is minimal; and connecting the fingers corresponding to respective center pads with metal wirings have high conductivity. SOLUTION: The semiconductor device is obtained, by wiring a first surface and a second surface, fixing a circuit board having a through-hole to a main surface of the first centered pad semiconductor chip, fixing the rear surface of the first semiconductor chip to that of the second semiconductor chip via a connecting material, then connecting the pads of the chips to the fingers of the corresponding circuit board with a metal wiring, sealing one side surface of the board with a sealing resin, and embedding the vicinity of the through-hole at the other surface of the board for sealing it. |
