发明名称 |
SOLDER ATTACHING DEVICE FOR ELECTRIC WIRE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a solder attaching device for an electric wire, which is improved so as to rapidly attach solder to the tip of the conductor of the electric wire with high quality. SOLUTION: Parting of solder attached to the conductor 2a hardly becomes diagonal to the axis of the electric wire 2 or the thickness of attached solder hardly becomes irregular in the circumferential direction because the tip end of the conductor 2a is immersed in a solder liquid in the direction vertical to the liquid. Also, solder is surely attached to a prescribed range of the conductor 2a because an ascending and descending position of an ascending and descending part 30 is controlled by a control part in accordance with the height of the liquid surface of the solder liquid detected by using a liquid surface sensor. Further, since descending speed in the case of immersing the conductor 2a in the solder liquid is changed in accordance with the diameter of the conductor 2a, solder attaching work is rapidly performed while surly attaching solder to the conductor 2a.</p> |
申请公布号 |
JP2002210556(A) |
申请公布日期 |
2002.07.30 |
申请号 |
JP20010008236 |
申请日期 |
2001.01.16 |
申请人 |
JAPAN AUTOMAT MACH CO LTD |
发明人 |
KAKINAMI NORIAKI;OZAWA RYOICHI;KANAYAMA KIYOSHIGE |
分类号 |
B23K3/00;B23K1/00;B23K3/06;H01R43/00;H01R43/28;H02G1/14;(IPC1-7):B23K3/00 |
主分类号 |
B23K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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