| 摘要 |
<p>Hybrid modules 14, 15 are die-bonded to bonding lands 13 of an inner substrate 1. Outer substrates 2, 3 are laminated to the inner substrate 1 so that the hybrid modules are sandwiched between the inner substrate 1 and the outer substrates 2, 3. Connection holes 2, 3 are formed in the outer substrates 2, 3, and plating treatment is performed so that the hybrid modules 14, 15 are electrically connected to the outer substrates 2, 3. The hybrid modules 14, 15 each have an electronic component, such as a resistor, a capacitor or a semiconductor chip, disposed therein. Accordingly, the resultant multilayer printed circuit board assumes a structure such that electronic components are buried in the substrate laminate. Due to this burying in the substrate laminate in addition to the mounting of electronic components on the outer surfaces of the substrate laminate, the multilayer printed circuit board of the present invention can have an increased volume of electronic components disposed therein. <IMAGE></p> |
