BALL GRID ARRAY INTEGRATED CIRCUIT PACKAGE CONTAINING SOLDER-CONNECTED THERMAL CONDUCTOR

摘要

PURPOSE: To provide an integrated circuit package, with which an improved thermal conductivity is applied between a package chip and a circuit board. CONSTITUTION: An opening is formed in a substrate 14, and a thermally conductive slug 12 is received in the opening. An integrated circuit chip 10 is mounted to one side of slug, and the opposite side of slug is exposed at the underside of substrate. A chip 10 is wire bonded to the substrate 14 and is encapsulated by a sealing object 16. To the underside of the substrate and the slug, a solder ball 18 is attached in the form of ball grid array and mounted onto a circuit board 10. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board through the slug and the solder balls.