| 摘要 |
A microwave band probing apparatus includes a wafer stage for mounting a wafer on which a plurality of microwave integrated circuits are present, an RF probe head for transmitting a microwave signal to a prescribed one of the microwave integrated circuits, and a shielding member covering the prescribed microwave integrated circuit when the RF probe head is in contact with an electrode pad of the microwave integrated circuit. Because the shielding member is electrically connected to the probe stage during probing and thereby a ground plane is produced above the microwave integrated circuit as in a packaged state, the conditions upon the measurement of microwave characteristics in the on-wafer state and in the packaged state are approximately the same.
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