| 摘要 |
PROBLEM TO BE SOLVED: To reduce the process fraction defective of electronic parts by preventing the entrance of solder or flux into a package in mounting a circuit board without deteriorating the mechanical strength and high-frequency characteristic of the package. SOLUTION: A frame-like bank section 2b is formed of a resin so as to surround a chip 3 on one surfaces of lead frames 4 and 5 mounted with the chip 3. On the other surfaces of the frames 4 and 5, a substrate section is formed as if the frames 4 and 5 are held between the bank section 2b and the substrate section. In addition, anchor holes 4c and 5c are drilled at the parts where the frames 4 and 5 come into contact with the bank section 2b, namely, into bank-section leads 4d. The substrate section and bank section 2b are connected to each other by filling up the holes 4c and 5c with a resin. At both ends of the leads 4d and 5d, in addition, semicircular, triangular, or square notches 4e and 4e or 5e and 5e are formed. |
