发明名称
摘要 PURPOSE:To obtain a parison having proper wall thickness and to smoothly replace resin by forming a manifold branched from the surface of a mandrel to the right and the left in the circumferential direction and directed to an opposite side to a port of resin and fitting a dies lower plate which has a die gap between cores and is larger than the dies housing to the lower part of the dies housing. CONSTITUTION:Molten resin supplied to the inflow port 21 of resin is branched from the surface of a mandrel 16 of the inflow port 21 side to the right and the left in the circumferential direction. Manifolds 20 are formed toward an antiinflow port 21 side for resin of a mandrel 16. The ends of the manifolds 20 are respectively joined to the manifolds 20 of the opposite face side in the position of about 180 degrees from the inflow port 21 of resin. Further a dies lower plate 6 is fitted to the lower part of a dies housing 12. A die gap 17 is formed between the dies lower plate 6 and a core 15. Width dimension of the dies housing 12 is smaller than the width dimension in the horizontal direction of the dies lower plate 6. Thereby the material is easily replaced.
申请公布号 JP2795367(B2) 申请公布日期 1998.09.10
申请号 JP19930002023 申请日期 1993.01.08
申请人 UBE KOSAN KK 发明人 KANO YOSHIAKI;SHIBATA TAKAAKI
分类号 B29C49/04;B29C49/78;B29L22/00;(IPC1-7):B29C49/04 主分类号 B29C49/04
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