| 摘要 |
PURPOSE:To enable using the wiring design tool of a conventional general-pur pose multilayer wiring board, which uses a via hole as a through hole, by facili tating setting wiring terminal coordinates at the time of wiring design in a multilayer thin-film wiring board. CONSTITUTION:For the purpose of observing a rule that no via hole 14 should be formed on a via hole 14, the via hole 14 is formed in X-direction and Y- direction wiring layers while the coordinates of wiring terminals 13 containing the via hole 14 are shifted by every two grids in the X- and Y-directions so as not to hinder X-direction and Y-direction wirings, respectively. However, in order that the coordinates of the wiring terminals 13 containing the via hole 14 are made the same in all pair layers 41, 42, 43, the via hole 14 is formed in respective ground layers 21, 27, 33, 39 while the coordinates of terminals 15 containing the via hole 14 are shifted by every 2.2<1/2> grids in the 45 deg.-direction. |
