| 摘要 |
<p>The invention concerns contactless smart cards. In order to facilitate the fixing of an integrated circuit chip in a contactless smart card, and in particular the chip connection with the antenna incorporated in the card, the method consists in soldering on the chip contact pads (12a, 12b) a gold wire (30) with at least one end projecting above the chip. The wire (30) is preferably soldered while the chip is still part of a semiconductor wafer. The wire can be soldered between two contact pads on a common chip; it can also be soldered between two contact pads of two adjacent chips on the wafer and then sawed during dicing. When the chip is incorporated in the card, it is pressed against the antenna so that the soldered wire is contacted with the coiled or printed antenna feeder end.</p> |
